High quality glass borosilicate bf33
l Introduction:
As PLC chips, FA array optical communication systems and V groove chip electronic components with high precision, the glass photosensitivity, heat resistance and acid and alkali have high requirements, making the whole optical system in the face of harsh working environment can still maintain excellent stability.
l Product features:
a)High heat resistance
b)The whole band range has excellent transmission performance
c)Good resistance to strong alkali
d)Excellent surface shape accuracy
l Glass technical parameters:
a)Material: BOROFLOAT® 33、TEMPAX®
b)Thickness:0.1、0.2、0.3、0.4、0.5、0.6、0.7、1.0mm、1.5mm (Tolerances+ / - 0.02 mm)
c)standard size:Φ4"、Φ5"、Φ6"、85´85mm、105mm´105mm、150´150mm (other size can be customized)
d)MIL：60/40
e)Roughness (Ra) Less-1.5nm
f)TTV Less 0.01mm
g)Chamfer C0.05～0.2mm
l Product main technical parameters:
|
Technical parameters: |
|
|
Density (25 ℃) |
2.2g/cm2 |
|
Expansion coefficient(ISO 7991) |
3.25´10-6k-1 |
|
Transmittance |
91% |
|
Softening point |
820℃ |
|
Short time use less 10h |
550℃ |
|
Long time use more 10h |
450℃ |
|
Refractive index |
1.47140 |
|
Knoop hardness |
480 |
